| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable circuit board which can prevent stress load due to a difference in a wiring density of wiring pattern layers, and to provide a circuit apparatus using the same. SOLUTION: This circuit apparatus 50 in which a metal substrate 1 having openings 2 as a core member is provided in the inside of a circuit board 10 has protrusions 1a on the end of a bottom surface side of the openings 2 and depressions 1b on the end of top surface side of the openings 2. Wiring pattern layers 4, 6 are each formed on both the surfaces of the metal substrate 1 via insulation layers 3, 5, conductive layers 8 piercing the metal substrate 1 via the openings 2 and connecting the wiring pattern layers 4 to the wiring pattern layers 6 are formed in order to electrically connecting each of the wiring pattern layers, and conduction between the wiring pattern layers can be obtained. Furthermore, semiconductor chips 20 are directly connected on the top surface side of the circuit substrate 10 via solder balls 21. COPYRIGHT: (C)2007,JPO&INPIT
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