发明名称 PROCESS FOR FABRICATING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To solve a matter that the impact of variation in fabrication of elements has increased as scaling down progresses and since the impact is especially significant when paired transistors (pair transistor) are used, a processing technology of higher precision is required. SOLUTION: In the process for fabricating a semiconductor device, the gate electrode of a first transistor group including a pair transistor is formed by performing first etching on a gate electrode layer, and the gate electrode of a second transistor group is formed by performing second etching different from the first etching on the gate electrode layer. With such a process, characteristics of pair transistors can be arranged. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007066958(A) 申请公布日期 2007.03.15
申请号 JP20050247382 申请日期 2005.08.29
申请人 NEC ELECTRONICS CORP 发明人 NAGATA TAKAMI;FURUTA HIROSHI
分类号 H01L21/8234;H01L21/822;H01L27/04;H01L27/06;H01L27/088 主分类号 H01L21/8234
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