TRANSFER FILM COMPRISING A LAYER WITH A RELIEF STRUCTURE

摘要

The invention relates to a transfer film, in particular a hot embossing film, comprising a support film (18) and a transfer layer with a structured surface (14) that is applied to the support film (18) and can be detached from the latter (18). According to the invention, the support film (18) comprises a master relief structure (18m) on the side facing the structured layer (14) and the latter (14) comprises a relief structure (14o) that complements the master relief structure of the support film (18) on the side facing said film (18). The invention also relates to a method for producing the transfer film and to a multi-layered body (1) that is formed using said structured layer (14), the latter having a thickness of <100 µm.