| 发明名称 |
Circuit board for soldering surface-mounted devices in a reflow soldering oven comprises a contact surface for a connecting pin of a wired component |
| 摘要 |
<p>Circuit board (10) for soldering surface-mounted devices in a reflow soldering oven comprises a contact surface (24) for a connecting pin (40) of a wired component. A prescribed amount of solder (28) is provided which has a higher melting temperature than the solder paste.</p> |
| 申请公布号 |
DE102005043279(A1) |
申请公布日期 |
2007.03.15 |
| 申请号 |
DE20051043279 |
申请日期 |
2005.09.09 |
| 申请人 |
ENDRESS + HAUSER GMBH + CO. KG |
发明人 |
BIRGEL, DIETMAR;HAUPTVOGEL, KARL-PETER |
| 分类号 |
H05K3/34 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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