MANUFACTURING METHOD OF COPPER CLAD LAMINATE FOR VIA ON PAD

摘要

A method for manufacturing a copper clad laminate for a VOP(Via On Pad) is provided to form a non-through type via-hole without additional process and cost by using a protection layer as a thermal radiation layer. A method for manufacturing a copper clad laminate for a VOP includes the steps of: providing first and second copper clad layers having a protection layer(S100); stacking the first copper clad layer, an insulation layer, and the second clad layer on upper and lower parts about an adhesive layer(S200); removing the protection layer formed on one surface of the second copper clad layer, and removing a part of the second copper clad layer(S300); forming a via-hole by removing the insulation layer in a region from which the second copper layer is removed through a laser process(S400); and forming two copper clad laminates by removing the protection layer and the adhesive layer formed on one surface of the first copper clad layer(S500). The protection layer formed on one surfaces of the first and second copper clad layers is stacked not to contact the insulation layer.