| 摘要 |
PROBLEM TO BE SOLVED: To provide a fixing and transporting tool for an electronic component where the electronic component can be detached easily even when the thickness of the electronic component such as a semiconductor wafer is reduced and ambient humidity is low and contamination of the electric component is suppressed. SOLUTION: The tool is provided with a support substrate 1 having rigidity; and a bendable and deformable holding layer 10 adhered to the periphery 2 of the surface of the support substrate 1, and holding a thin semiconductor wafer W of a 300 mm aperture detachably. Between the surface excepting for the periphery 2 of the support substrate 1 and a holding layer 10, a division space 3 is formed. A feeding and discharging hole 4 communicated with the space 3 is bored at the substrate 1, and a plurality of protrusions 6 contacting with the holding layer 10 are formed on the surface excepting for the periphery 2 of the substrate 1. The holding layer 10 is formed of an contacting and holding layer 11 adhering the semiconductor wafer W detachably, and a charging prevention layer 12 laminated to the rear surface of the contacting and holding layer 11. COPYRIGHT: (C)2007,JPO&INPIT |
