| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered circuit board wherein inner via holes are perfectly filled with an insulating material without non-filling nor insufficient filling even if the inner via holes are arranged in a narrow pitch, and also to provide its manufacturing method. SOLUTION: The multilayered circuit board includes a plurality of inner via holes 4 which are distributed in the plane of a lower-layer circuit board 2A. Out of these inner via holes 4, some of them are filled with insulating ink 5 while the rest are filled with a constituent resin 6a of an upper-layer circuit board 6A arranged immediately above the lower-layer circuit board 2A. COPYRIGHT: (C)2007,JPO&INPIT |
