| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring structure whereby a space between a driver IC and a driving element with a step can be made conductive by a fine pitch and without causing disconnection, and to provide a device, a manufacturing method for the device, a liquid droplet ejecting head, a manufacturing method for the liquid droplet ejecting head, and a liquid droplet ejector. SOLUTION: The wiring structure is provided by setting a second member 20 on a first member 10. A second conductive part 44 prepared at the second member 20 and a first conductive part 90 formed on the top face of the first member 10 are electrically connected with each other by wiring 34. The second member 20 is equipped with a step structure. The second conductive part 44 is formed at an upper step of the step structure. A penetrating conductive part 85 is formed at a lower step of the step structure which penetrates the lower step and becomes conductive to the first conductive part 90. The wiring 34 is led from the top face of the upper step to the top face of the lower step passing on a step surface which makes the upper step and the lower step continuous with each other, thereby connecting a space between the second conductive part 44 and the penetrating conductive part 85. COPYRIGHT: (C)2007,JPO&INPIT
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