发明名称 ANALYZING METHOD OF SOLDER MATERIAL
摘要 PROBLEM TO BE SOLVED: To rapidly quantify the content of the constituent elements of a solder alloy. SOLUTION: This method for quantitatively analyzing the constituent elements of the solder alloy containing tin and silver includes a process for decomposing a solder sample by nitric acid and a process for quantitatively analyzing the constituent elements in the decomposed solution. By this method, the solder sample can be decomposed without forming an insoluble component and the constituent elements of the solder alloy can be quantified rapidly and accurately. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007064861(A) 申请公布日期 2007.03.15
申请号 JP20050253014 申请日期 2005.09.01
申请人 TOSHIBA CORP 发明人 OKI MITSUHIRO;TATEBE TETSUYA;TAKENAKA MIYUKI
分类号 G01N1/28;G01N33/00 主分类号 G01N1/28
代理机构 代理人
主权项
地址