STACKED SEMICONDUCTOR PACKAGE

摘要

A stacked semiconductor package is provided to improve a heat radiation characteristic by broadening a contact area of a circuit board of a unit package and external air. A plurality of unit packages(10) are prepared of which each includes a circuit board and a semiconductor chip electrically connected to the circuit board. The circuit board of a part of the unit packages has a broader area than that of the rest of the unit packages. The circuit board of a unit package having a broader area can be a circuit board of an intermediately stacked unit package.