| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor component joining device and a semiconductor component joining method for highly precisely joining semiconductor components in a batch to the adhesive predetermined position of a junction substrate. SOLUTION: A deviation value between the position of a semiconductor component 7 and the joining position of the semiconductor component before junction is measured; a fixing pin 3 for fixing the position of the semiconductor component 7 on a polishing plate 11 is arranged at the support position of the semiconductor component, so that the deviation value can be turned to be a predetermined value or less; and the semiconductor component 7 is joined to the joining position of the semiconductor component, in such a status that the position of the semiconductor component 7 is fixed by the fixing pin 3. COPYRIGHT: (C)2007,JPO&INPIT
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