| 摘要 |
PROBLEM TO BE SOLVED: To reduce waterdrops which remain on substrate so as to suppress the heating unevenness caused by waterdrops or watermarks, for example, at the heat processing after exposure, when carrying out spin cleaning of the surface of a substrate. SOLUTION: A substrate cleaning method is carried out such that, while moving the supply position of cleaning fluid from a cleaning fluid nozzle 5 from the central part of the substrate toward its periphery, it sprays gas directed toward the outside of the substrate to the lower stream side region, in the rotating direction of the substrate rather than the supply position. Since the force directed to the outside is generated by an air flow, in a state where the cleaning fluid flowing slightly on the surface of the substrate by this way so as become a liquid film, the fluid current which flows in the direction of a circumference moves outside. Since a lump of liquid is formed, by restraining cleaning fluid discharged from the cleaning fluid nozzle by a liquid control face formed to the same height as a discharge mouth, or at a position lower than it, the centrifugal force becomes large, even at low rotation and action in which the lump of the liquid goes to the outside becomes large. COPYRIGHT: (C)2007,JPO&INPIT
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