| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method capable of efficiently and inexpensively manufacturing a wiring board having a through conductor wiring. SOLUTION: This method has a substrate preparing process; a resin layer forming process of forming a resin layer on one side surface of a substrate to seal an opening of one end of a through hole; a conductive supporter preparing process; substrate-conductive supporter joining process of joining the substrate to a conductor supporter via the resin layer; a conductive supporter exposing process of removing the resin layer in a position where an opening of the one end of the through hole of the substrate is sealed to expose one part of the conductive supporter; and a metal film forming process of forming a metal film on the through hole by an electroplating method using the conductive supporter as a cathode. In this method, the metal film forming process has an operation for initially forming a tin film or an alloy film containing as tin a main component, and an operation for subsequently forming a film containing copper, gold and platinum or an alloy film containing them as a main component. COPYRIGHT: (C)2007,JPO&INPIT
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