| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation that does not cause short circuits of wiring nor electric defects such as a leakage defect, and has laser marking property and excellent colorability. SOLUTION: This epoxy resin composition for semiconductor encapsulation comprises an epoxy resin (A), a phenolic resin (B), an inorganic filler (C), a hardening accelerating agent (D) and a perylene-based coloring agent (E), wherein preferably the perylene-based coloring agent (E) contains one or more species selected from among perylene tetracarboxylic anhydrides, diimide derivatives of perylene tetracarboxylic acids and diimide derivatives of perylene diiminodicarboxylic acids. The semiconductor device is obtained by encapsulating a semiconductor using the resin composition. COPYRIGHT: (C)2007,JPO&INPIT
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