| 摘要 |
The present invention is directed to a lamination apparatus and a lamination method using the same. The lamination apparatus includes a process chamber and a pump connected with one side of the process chamber for making the interior of the process chamber a vacuum. Inside the process chamber, a first and a second supply unit, an injection unit, and a bonding unit are provided. The first and the second supply units supply a first and a second metal sheet, respectively. The injection unit injects a bonding material between the first and the second metal sheets supplied, and the bonding unit bonds the first and the second metal sheets with each other. According to the present invention, a bonding force of the bonding material may be enhanced and various kinds of bonding materials may be used.
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