| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a high-quality, high- productivity and inexpensive assembly mounted with a semiconductor part, a method for manufacturing a finished product mounted with a semiconductor part, and a finished product mounted with a semiconductor part. SOLUTION: A semiconductor element 114 is buried in a first thermoelestic resin substrate 122, and a circuit pattern 116 is formed on the buried semiconductor element 114, thereby completing the mounting. Therefore, no anisotropic conductive sheet is used for mounting, so that the productivity can be improved greatly and the cost be reduced significantly than before. In addition, since the circuit pattern 116 is formed on the buried semiconductor element 114, the semiconductor element 114 can be prevented from sinking in the substrate. As a result, parts mounted with semiconductor part which has no disconnection in the circuit pattern and high quality can be produced stably. |
