| 发明名称 |
LEAD SOLDER INDICATOR AND METHOD |
| 摘要 |
<p>A solder system includes a lead (Pb) indicator and a solder flux. A method for forming a semiconductor device includes providing a carrier, applying the solder system to the carrier, coupling the terminal to the carrier via the solder system, melting the solder system to attach the terminal to the carrier and form a completed semiconductor device, and determining if the completed semiconductor device has a different predetermined property from the solder system.</p> |
| 申请公布号 |
EP1761951(A2) |
申请公布日期 |
2007.03.14 |
| 申请号 |
EP20050751936 |
申请日期 |
2005.05.19 |
| 申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
BURNETTE, TERRY, E.;KOSCHMIEDER, THOMAS, H. |
| 分类号 |
H01L21/66;G01R31/26;H01L21/44;H01L21/48;H01L21/50;H01L21/60;H01L23/48;H01L23/498;H01L23/52;H01L23/544;H01L29/40;H05K1/02;H05K3/34 |
主分类号 |
H01L21/66 |
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