发明名称 ROBOT ARM OF WAFER TRANSFER APPARATUS
摘要 A robot arm of a wafer transfer apparatus is provided to perform smoothly a wafer absorbing process regardless of the damage of a wafer support unit by using an improved arrangement of a first exhaust line. A robot arm of a wafer transfer apparatus includes a blade, a wafer support unit, a first exhaust line and a second exhaust line. The blade(112) is used for supporting a wafer. The wafer support unit(114) is installed on the blade. The wafer support unit has at least one vacuum hole(115). The exhaust line(122) is installed under the wafer support unit. The first exhaust line is connected through the vacuum hole of the wafer support unit. The second exhaust line(124) is used for connecting the first exhaust line to a vacuum pump. The wafer support unit includes a wafer support region(114a) and an edge region(114b). The first exhaust line is installed under a predetermined portion of the wafer support region, wherein the predetermined portion is spaced apart from the edge region.
申请公布号 KR20070029522(A) 申请公布日期 2007.03.14
申请号 KR20050084417 申请日期 2005.09.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JEON, SEONG OK;KIM, SUNG JUN;CHA, KIL SEOK;HAM, KYU HWAN
分类号 H01L21/68 主分类号 H01L21/68
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