APPARATUS FOR CLEANING PAD AND DISPERSING SLURRY IN CHEMICAL MECHANICAL POLISHING EQUIPMENT

摘要

An apparatus for cleaning a pad and dispersing slurry in CMP equipment is provided to prevent the generation of micro scratches on a wafer and to extend the lifetime of the slurry using an ultrasonic generating unit. An apparatus for cleaning a pad and dispersing slurry in CMP equipment includes a polishing table(31), a polishing pad(32) attached on the polishing table, a supply unit, and an ultrasonic generating unit. The supply unit(35) is installed at an end portion of a supply line to supply the slurry and deionized water to an upper portion of the polishing table. The ultrasonic generating unit(36) is installed at the supply unit to prevent the agglomeration of slurry grains and re-dispersing the slurry.