发明名称 |
Conductive pattern material and method for forming conductive pattern |
摘要 |
<p>There are provided a conductive pattern material and a pattern-forming method by which a fine pattern having a high resolution and no wire breakage is obtained. The conductive pattern material is such that on a support surface a pattern-forming layer is formed which allows the formation of a hydrophilic/hydrophobic region directly bonded to the support surface due to energy imparted. Energy is imparted to the pattern-forming material in an imagewise manner to form the conductive material layer.
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申请公布号 |
EP1282175(A3) |
申请公布日期 |
2007.03.14 |
申请号 |
EP20020016949 |
申请日期 |
2002.08.01 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
KAWAMURA, KOICHI;YAMASAKI, SUMIAKI;NAKAYAMA, TAKAO;KANO, TAKEYOSHI;TAKAHASHI, MIKI |
分类号 |
H05K3/10;H01L51/30;H01L51/05;H01L51/40 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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