发明名称 Conductive pattern material and method for forming conductive pattern
摘要 <p>There are provided a conductive pattern material and a pattern-forming method by which a fine pattern having a high resolution and no wire breakage is obtained. The conductive pattern material is such that on a support surface a pattern-forming layer is formed which allows the formation of a hydrophilic/hydrophobic region directly bonded to the support surface due to energy imparted. Energy is imparted to the pattern-forming material in an imagewise manner to form the conductive material layer. </p>
申请公布号 EP1282175(A3) 申请公布日期 2007.03.14
申请号 EP20020016949 申请日期 2002.08.01
申请人 FUJIFILM CORPORATION 发明人 KAWAMURA, KOICHI;YAMASAKI, SUMIAKI;NAKAYAMA, TAKAO;KANO, TAKEYOSHI;TAKAHASHI, MIKI
分类号 H05K3/10;H01L51/30;H01L51/05;H01L51/40 主分类号 H05K3/10
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