发明名称 FILM FORMATION APPARATUS
摘要 A film forming apparatus is provided to enhance uniformity of thickness in a thin film and to improve the throughput by using a deposition source moving mechanism. A film forming apparatus includes a deposition source and a deposition source moving mechanism. The deposition source(104) has a length direction. The deposition source moving mechanism is used for moving the deposition source vertical to the length direction of the deposition source. The deposition source includes a deposition cell(103) with the length direction. The deposition source includes a plurality of deposition cells.
申请公布号 KR20070029770(A) 申请公布日期 2007.03.14
申请号 KR20070007411 申请日期 2007.01.24
申请人 SEMICONDUCTOR ENERGY LABORATORY K.K. 发明人 YAMAZAKI SHUNPEI;FUKUNAGA TAKESHI
分类号 H01L21/20;H05B33/10;C23C14/00;C23C14/04;C23C14/12;C23C14/24;C23C14/56;G09F9/00;H01L21/203;H01L21/205;H01L51/00;H01L51/50;H05B33/14 主分类号 H01L21/20
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