| 发明名称 |
DOUBLE DENSITY METHOD FOR WIREBOND INTERCONNECT |
| 摘要 |
In an integrated circuit package 96, a first wire 109 is bonded to a first die bond pad 98 to form a first bond 108 and the first wire 109 is bonded to a bond post 104 to form a second bond 106. A second wire 111 is bonded to the first bond 108 and coupled to the bond post 104. ® KIPO & WIPO 2007 |
| 申请公布号 |
KR20070029749(A) |
申请公布日期 |
2007.03.14 |
| 申请号 |
KR20067026758 |
申请日期 |
2006.12.19 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
GERBER MARK ALLEN |
| 分类号 |
H01L21/60;H01L21/607;H01L23/48;H01L25/065 |
主分类号 |
H01L21/60 |
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