发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a apparatus for inspecting printing solder which improves the accuracy of inspecting the displacement of the print of solder on a flexible printed circuit board. <P>SOLUTION: The inspection apparatus comprises a reference data generating means 10 of generating positional data of a piece recognition mark of each piece, storage means 14 of storing inspection data of solder, on the piece and the position data of the piece recognition mark; a measurement means 15 of acquiring positional measurement data of the piece recognition mark of the piece and positional measurement data of the solder; a mark position deciding means 16 of deciding whether the amount of displacement between the position data and the position measurement data of the piece recognition mark is included in a mark displacement permissible range; a correction means 18 of correcting the position data of solder included in the inspection data of the piece, decided as being included in the mark displacement permissible range, according to the amount of displacement; and a print condition deciding means 19 of deciding the quality of the printing condition of each solder, by comparing the measured data on the position of the solder measured with the inspection data with the position data corrected. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP3893132(B2) 申请公布日期 2007.03.14
申请号 JP20040013816 申请日期 2004.01.22
申请人 发明人
分类号 B41F33/14;G01B21/00;G01B11/00;G01N21/956;H05K3/34 主分类号 B41F33/14
代理机构 代理人
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