| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding wire which can maintain the workability of bonding even when the gold content is reduced, and is hard to be deformed by a sealing resin. <P>SOLUTION: This bonding wire is made of two extremely fine gold wires having a prescribed diameter bonded in parallel, or made of an extremely fine gold wire and an extremely fine gold alloy wire having a prescribed diameter bonded in parallel, or the bonding wire has an elliptical shape in its cross section having the longest diameter of 50 μm or less. When the bonding wire is used, the direction of the longest diameter 1 is made to meet with the flow-in direction of a resin for sealing with the resin, thereby reducing the needed amount of gold while maintaining the strength of the bonding wire. Hence, resource saving and cost reduction are made possible. <P>COPYRIGHT: (C)2004,JPO |
