| 发明名称 |
Solder composition for semiconductor bumps |
| 摘要 |
A semiconductor device includes a semiconductor element having a plurality of element electrodes and a ball electrode electrically connected to at least one element electrode out of the plurality of element electrodes. The ball electrode is made of a Sn-Zn-based lead-free solder including 7 through 9.5 wt% of zinc and the remaining of tin. |
| 申请公布号 |
EP1298726(A3) |
申请公布日期 |
2007.03.14 |
| 申请号 |
EP20020022210 |
申请日期 |
2002.10.01 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
OIDA, SEISHI;SAKAGUCHI, SIGEKI;OHMORI, KOJI;JITUMORI, KENROU |
| 分类号 |
B23K35/26;H01L23/498;H01L21/48;H01L21/60;H01L23/12;H01L23/31;H01L23/485;H05K3/34 |
主分类号 |
B23K35/26 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
