| 摘要 |
A dry cleaning apparatus for semiconductor plasma processing equipment is provided to check the thickness of an inner wall of a process chamber by using a gas leak detecting unit capable of detecting exactly the leak of a gas through the inner wall of the process chamber. A dry cleaning apparatus for semiconductor plasma processing equipment includes a process chamber, a gas charge layer, and a gas leak detecting unit. The process chamber(100) is composed of an inner wall and an outer wall for enclosing the inner wall. The gas charge layer is located at a space between the inner and outer walls of the process chamber. The gas charge layer is filled with a gas. The gas leak detecting unit(200) is used for detecting the leak of the gas through the inner wall.
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