| 摘要 |
A grinding and/or polishing tool comprises a thin, substantially flat substrate, which has a grinding side to which grinding particles are applied, the substrate being substantially incompressible in a direction perpendicular to the grinding side, the grinding particles comprising diamond particles, and the grinding particles being fixed to the substrate by a curing plastic resin. Moreover, a grinding and/or polishing method is disclosed, in which such a grinding and/or polishing tool is used, and also a method of manufacturing such a grinding and/or polishing tool. |
