METHOD FOR MANUFACTURING CIRCUIT ELEMENT, METHOD FOR MANUFACTURING ELECTRONIC ELEMENT, CIRCUIT SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRO-OPTICAL APPARATUS

摘要

The present invention aims to provide a mounting technology that prevents unnecessary consumption of materials. A method for manufacturing a circuit element includes the steps of: setting a semiconductor element on a stage so that a metal pad of the semiconductor element faces a head; changing positions of the head relative to the semiconductor element; dispensing a liquid conductive material from a nozzle so that the conductive material is coated on the metal pad when the nozzle reaches a position corresponding to the metal pad; and either activating or drying the coated conductive material in order to obtain a UBM layer on the metal pad.