PLASMA PROCESSING APPARATUS WITH A DIELECTRIC PLATE HAVING A THICKNESS BASED ON A WAVELENGTH OF A MICROWAVE INTRODUCED INTO A PROCESS CHAMBER THROUGH THE DIELECTRIC PLATE,申请号KR20010014798-传众专利搜索

发明名称	PLASMA PROCESSING APPARATUS WITH A DIELECTRIC PLATE HAVING A THICKNESS BASED ON A WAVELENGTH OF A MICROWAVE INTRODUCED INTO A PROCESS CHAMBER THROUGH THE DIELECTRIC PLATE
摘要
申请公布号	KR100693695(B1)	申请公布日期	2007.03.09
申请号	KR20010014798	申请日期	2001.03.22
申请人		发明人
分类号	H01L21/20;H05H1/46;B01J19/08;C23C16/511;H01J37/32;H01L21/302;H01L21/3065;H01L21/31	主分类号	H01L21/20
代理机构		代理人
主权项
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