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发明名称
Method for manufacturing flip chip package using UV-curable tape
摘要
申请公布号
KR100688064(B1)
申请公布日期
2007.03.09
申请号
KR20010004243
申请日期
2001.01.30
申请人
发明人
分类号
H01L23/14
主分类号
H01L23/14
代理机构
代理人
主权项
地址
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