| 摘要 |
<p>Provided is a pressure-sensitive adhesive sheet, which is suitable as an adhesive sheet for processing semiconductor wafers, hardly contaminates or does damage semiconductor wafers during processing, and reduces warpage of a product by residual stress of the adhesive sheet. The pressure-sensitive adhesive sheet comprises a substrate, an intermediate layer, and an adhesive layer in the order stated. The intermediate layer has a tensile elasticity of 1-100MPa at 23‹C and is formed of acrylic polymer. The acrylic polymer is formed by polymerizing a (meth)acrylic monomer mixture comprising 1-20wt% of a nitrogen-containing acryl monomer. The acrylic polymer contains 20wt% or less of a polymer component having a molecular weight of 100,000 or less. The substrate comprises at least one layer of film having a tensile elasticity of 0.6GPa or more at 23‹C.</p> |
