MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a producing method of a semiconductor package where a manufacturing process of columnar electrodes absorbing stress is shortened by a screen printing system.

SOLUTION: A manufacturing method of a semiconductor device which forms rewiring and the electrodes on a silicon substrate by a wafer level package and which mounts connection terminals on the electrodes mounts a stepped screen having a first layer screen for printing the rewiring and a second layer screen for printing the electrodes at a prescribed place on the silicon substrate, and a metal paste is charged from the holes formed at the second layer screen to the holes formed at the first layer screen and the second layer screen with high pressure for printing. After printing is finished, the stepped screen is removed and cured at a prescribed temperature.

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