| 摘要 |
A multi-chip stack structure includes at least one first chip having an active surface and an opposed non-active surface, wherein the active surface is formed with a plurality of connecting pads thereon; a plurality of electrical contacts formed around the first chip; an insulating layer formed on the first chip and the electrical contacts, wherein the insulating layer is formed with a plurality of openings for exposing the connecting pads and the electrical contacts; a plurality of redistributed circuit layers formed on the insulating layer, for electrically connecting the connecting pads of the first chip to the electrical contacts; at least one second chip mounted on the redistributed circuit layers and electrically connected to the redistributed circuit layers by a flip-chip or wire-bonding process; and an encapsulant formed on the second chip, the insulating layer and the redistributed circuit layers, with the electrical contacts being exposed from the encapsulant.
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