TiN layer structures for semiconductor devices, methods of forming the same, semiconductor devices having TiN layer structures and methods of fabricating the same

摘要

TiN layer structures for semiconductor devices, methods of forming TiN layer structures, semiconductor devices having TiN layer structures and methods of fabricating semiconductor devices are disclosed. The TiN layer structure for a semiconductor device includes a TiN base layer and a conductive capping layer. The TiN base layer is formed on a substrate. The conductive capping layer is formed on the TiN base layer by laminating unit layers repeatedly.