| 摘要 |
A method of manufacturing a crystal oscillator comprises: processing a crystal wafer, which has higher oscillation frequency inversely proportional to its thickness, into a thickness for a lower oscillation frequency than a reference oscillation frequency; measuring and storing the oscillation frequency of each area located lengthwise and crosswise of the crystal wafer, and subtracting the thickness of each area in turn depending on the difference in frequency of the oscillation frequency of each area and the reference oscillation frequency; and then obtaining a number of crystal pieces by dividing the crystal wafer into each area, wherein the crystal wafer is provided with dividing grooves in lengthwise and crosswise directions that section the crystal wafer into the individual areas. An object of the invention is to provide a method of manufacturing a crystal oscillator in which the thickness accuracy of each area of a crystal wafer is improved.
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