发明名称 PHOTO DIODE, SOLID IMAGING DEVICE, AND THEIR FABRICATION METHOD
摘要 <p>A photo diode is formed on a silicon substrate and comprises a light receiving region, an intermediate region, a contact region, a shield layer, and an electrode. The light receiving region is formed on the surface of the silicon substrate and includes a diffusion region of a first conduction type forming a pn-junction. The intermediate region includes a diffusion region of the first conduction type so formed on the surface of the silicon substrate as to be included in the light receiving region. The contact region includes a diffusion region of the first conduction type so formed on the surface of the silicon substrate as to be included in the intermediate region. The shield layer includes a diffusion region of a second conduction type formed outside the intermediate region on the surface of the silicon substrate. The electrode is in contact with the contact region. The shield region faces a side edge of the diffusion region constituting the intermediate region.</p>
申请公布号 WO2007026409(A1) 申请公布日期 2007.03.08
申请号 WO2005JP15838 申请日期 2005.08.31
申请人 FUJITSU LIMITED;KATAYAMA, MASAYA 发明人 KATAYAMA, MASAYA
分类号 H01L31/10;H01L27/146 主分类号 H01L31/10
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