发明名称 |
METHOD OF MANUFACTURING SOLID STATE IMAGING DEVICE, SOLID STATE IMAGING DEVICE, AND CAMERA USING SOLID STATE IMAGING DEVICE |
摘要 |
A method for manufacturing a solid state image pickup device, the solid state image pickup device manufactured thereby and a camera using the same are provided to reduce remarkably the thickness of a light shielding layer by separating completely the light shielding layer from a transparent layer using an anti-oxidation passivation layer. A light shielding material layer(16) is formed on a semiconductor substrate with a photoelectric transformation array and a transfer electrode array. An opening corresponding to a photoelectric transformation part(12) is formed on the light shielding material layer by performing an etching process on the resultant structure using an etch mask. An anti-oxidation passivation layer(34) is formed on the photoelectric transformation part and the light shielding layer. A transparent layer(26,28) is formed on the anti-oxidation passivation layer.
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申请公布号 |
KR20070026255(A) |
申请公布日期 |
2007.03.08 |
申请号 |
KR20060084505 |
申请日期 |
2006.09.04 |
申请人 |
SONY CORPORATION |
发明人 |
TAKEDA TAKESHI;DOFUKU TADAYUKI;TAKEO KENJI |
分类号 |
H01L27/14 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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