发明名称 METHOD OF MANUFACTURING SOLID STATE IMAGING DEVICE, SOLID STATE IMAGING DEVICE, AND CAMERA USING SOLID STATE IMAGING DEVICE
摘要 A method for manufacturing a solid state image pickup device, the solid state image pickup device manufactured thereby and a camera using the same are provided to reduce remarkably the thickness of a light shielding layer by separating completely the light shielding layer from a transparent layer using an anti-oxidation passivation layer. A light shielding material layer(16) is formed on a semiconductor substrate with a photoelectric transformation array and a transfer electrode array. An opening corresponding to a photoelectric transformation part(12) is formed on the light shielding material layer by performing an etching process on the resultant structure using an etch mask. An anti-oxidation passivation layer(34) is formed on the photoelectric transformation part and the light shielding layer. A transparent layer(26,28) is formed on the anti-oxidation passivation layer.
申请公布号 KR20070026255(A) 申请公布日期 2007.03.08
申请号 KR20060084505 申请日期 2006.09.04
申请人 SONY CORPORATION 发明人 TAKEDA TAKESHI;DOFUKU TADAYUKI;TAKEO KENJI
分类号 H01L27/14 主分类号 H01L27/14
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