SPUTTERING TARGET, METHOD FOR PRODUCING SAME, SPUTTERING THIN FILM FORMED BY USING THE SPUTTERING TARGET, AND ORGANIC EL DEVICE USING THE THIN FILM

摘要

PROBLEM TO BE SOLVED: To provide a sputtering target capable of providing high moisture barrier properties and high flexibility to a sputtering film, ensuring the high film deposition rate in the sputtering, and reducing damages on an object for film deposition as much as possible.

SOLUTION: A powder mixture containing, in a weight ratio, 20-80% of SiO powder and the balance of TiO2powder and/or Ti powder is subjected to pressure sintering. The sintered body has a composition expressed as SiαTiβOγ (wherein α, β and γ represent respective molar ratios of Si, Ti and O), and α/β satisfies 0. 45-7.25 while γ/(α+β) satisfies 0.80-1.70.

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