| 摘要 |
PROBLEM TO BE SOLVED: To easily realize high-reliability interconnect line which is improved in an adhesive capacity of interconnect line material, in a manufacturing method of pierced hole interconnect line. SOLUTION: The method processes a semiconductor substrate 1 in the thickness direction to form a pierced hole 2 having openings in a front surface 1a of one side of the semiconductor substrate 1 and front surface 1b of the other side. After that, an insulating layer 3 is formed in a front surface including pierced hole 2 inner wall surface of the semiconductor substrate 1, then the penetration hole interconnect line of semiconductor substrate is manufactured, by filling a plating metal into pierced hole 2 interior formed in the insulating layer 3 through plating, and after forming the insulating layer 3 a metal layer 4 used for current-carrying is formed in the one side front surface 1a as a seed layer. An inner wall metal layer 5a is formed in the inner wall surface near the opening of pierced hole 2, formed in the insulating layer 3 which opens in the other side surface 1b of semiconductor substrate 1. Furthermore, plating of bottom-up system is processed, by turning on electricity between an electrode E for plating and metal layer 4 for applying current which are arranged separately, by facing each other in the other side front surface 1b of semiconductor substrate 1. COPYRIGHT: (C)2007,JPO&INPIT
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