发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor substrate processing apparatus, capable of beforehand preventing a manufacturing loss from occurring, by properly managing a consistency of a control parameter of each controller in a dispersed controller system. SOLUTION: A substrate processing apparatus is equipped with a process module which processes a substrate; a processing controller which controls the temperature, pressure, and gas flow rate in the process module, in accordance with a first parameter file; a conveyance controller which controls a mechanism for conveying the substrate, in accordance with a second parameter file; and an operation controller which instructs a control for performing the processing of the substrate to the processing controller and the conveyance controller. The operation controller verifies the consistency with the first and second parameter files, and a third parameter file held by the operation controller. When consistency is established, the control instruction is issued. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007059765(A) 申请公布日期 2007.03.08
申请号 JP20050245527 申请日期 2005.08.26
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 KATAOKA NORIHIKO;SAITO KAZUTO;TERANISHI ISAO
分类号 H01L21/02 主分类号 H01L21/02
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