| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module having even a high heat-dissipating effect while maintaining a shielding effect, though a material mainly using a magnetic substance such as iron must be used for a shielding cover to achieve the shielding effect but the heat-dissipating effect is not high generally in such a material. SOLUTION: The semiconductor module has a heat sink 201 and the shielding covers 101 and 102 for the magnetic substance having formed holes 501 penetrated to the projection 401 of the heat sink 201 and having a thermal conductivity lower than the heat sink. The semiconductor module further has a heat-dissipated semiconductor 203, and a substrate 1 loading the heat-dissipated semiconductor. In the semiconductor module, the substrate is surrounded by the shielding cover. COPYRIGHT: (C)2007,JPO&INPIT
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