| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method of a copper system material with metals of different kinds which can attain sufficient bonding strength and is desirable in its external appearance because generation of dust is suppressed; and also to provide a manufacturing method of sealed electronic component using the same bonding method. SOLUTION: The bonding method comprises the steps of forming a projection 22 to a first member 20 of a copper system material, conducting the plating process 30 at least to the projection, overlapping a second member 40 of a metal material which is different from the copper system material to the plated projection and then pressing these members, and feeding the electrical power between the first member and the second member. In the manufacturing method of sealed electronic component, the first member is used as a base board, an electronic component is placed on the base board, the second member is used as a cover for sealing process, and the base board and the sealing cover are bonded with the bonding method. COPYRIGHT: (C)2007,JPO&INPIT
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