| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board capable of preventing any bridge from occurring between adjacent soldering lands, by providing solder cutting lands in the vicinity of the soldering lands formed on the printed wiring board and by improving cutting property of a solder upon soldering. SOLUTION: The printed wiring board 1 is equipped with bridge prevention means, and includes at least two or more of the soldering lands 4a juxtaposed in close vicinity to each other in a direction perpendicular to the conveyance direction 3 of the printed wiring board 1 in an automated soldering apparatus. The bridge prevention means includes a first solder cutting land 6 formed at predetermined intervals on a conveyance direction 3 side of each soldering land 4a. Moreover, the printed wiring board includes, as the bridge prevention means, a second solder cutting land formed at the predetermined intervals at the rearmost part toward the conveyance direction of the soldering land. COPYRIGHT: (C)2007,JPO&INPIT
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