| 摘要 |
A three-dimensional interconnect interposer adapted for use in system in package (SIP) includes a wafer, at least an embedded passive device and at least an interconnect pattern disposed on the front surface of the wafer, a plurality of cavities exposing the inner contact pads of the interconnect pattern formed on the back surface of the wafer, and a back connect pattern disposed on the back surface of the wafer electrically connected to the interconnect pattern and the embedded passive device through the inner contact pads.
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