发明名称 |
SUBSTRATE FOR DEPOSITING GROUP III NITRIDE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for depositing group III nitride, a manufacturing method thereof, and a semiconductor device using the same where an AlN thin film is made to be comparatively thin and formed without getting nebula and where cracks and pits at a III group nitride film layer constituting a device element grown on the AlN thin film are reduced. <P>SOLUTION: The substrate 10 for depositing the group III nitride includes a base material 11 and the AlN thin film 12 as a buffer layer formed on the base material, and has a semiconductor device made of the group III nitride film formed thereon. The substrate 10 is constituted so that the AlN film may be deposited by a plurality of steps by changing a depositing condition at least once in the middle of the deposition. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007059850(A) |
申请公布日期 |
2007.03.08 |
申请号 |
JP20050246852 |
申请日期 |
2005.08.26 |
申请人 |
NGK INSULATORS LTD;DOWA HOLDINGS CO LTD |
发明人 |
SUMIYA SHIGEAKI;SHIBATA TOMOHIKO;MIYASHITA MASAHITO |
分类号 |
H01L21/205;H01L21/338;H01L29/812;H01L33/12;H01L33/32;H01L33/34;H01S5/323 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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