发明名称 SUBSTRATE FOR DEPOSITING GROUP III NITRIDE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate for depositing group III nitride, a manufacturing method thereof, and a semiconductor device using the same where an AlN thin film is made to be comparatively thin and formed without getting nebula and where cracks and pits at a III group nitride film layer constituting a device element grown on the AlN thin film are reduced. <P>SOLUTION: The substrate 10 for depositing the group III nitride includes a base material 11 and the AlN thin film 12 as a buffer layer formed on the base material, and has a semiconductor device made of the group III nitride film formed thereon. The substrate 10 is constituted so that the AlN film may be deposited by a plurality of steps by changing a depositing condition at least once in the middle of the deposition. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007059850(A) 申请公布日期 2007.03.08
申请号 JP20050246852 申请日期 2005.08.26
申请人 NGK INSULATORS LTD;DOWA HOLDINGS CO LTD 发明人 SUMIYA SHIGEAKI;SHIBATA TOMOHIKO;MIYASHITA MASAHITO
分类号 H01L21/205;H01L21/338;H01L29/812;H01L33/12;H01L33/32;H01L33/34;H01S5/323 主分类号 H01L21/205
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