| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component mounting method for preventing poor bonding when a thin semiconductor package is mounted by solder bonding. <P>SOLUTION: The electronic component mounting method is used for mounting to a substrate 3 an electronic component 11 with solder bumps 16 formed on the lower face. Solder paste 19 is printed on electrodes 3a of the substrate 3. The solder paste 19 is supplied to the solder bumps 16 by transfer. Then, the solder bumps 16 are respectively landed on the electrodes 3a via the solder paste 19. By this, it is possible to prevent the poor bonding when the thin semiconductor package is mounted by solder bonding while increasing an amount of molten solder, and securing wetting spread of the molten solder by a solder component in the solder paste 19 even when there is a gap between the solder bump 16 and the electrode 3a. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
