发明名称 APPARATUS AND METHOD FOR MACHINING RESIN MATERIAL BY LASER BEAM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus with which smoke and scattered materials which are generated when machining such as drilling and cutting is applied to a resin material by a laser light are prevented from adhering again to the resin material. <P>SOLUTION: In a laser beam machining apparatus with which a work such as drilling and cutting is applied to a long-shaped substrate of the resin material, the apparatus is provided with a laser light source 1 for generating a laser light, a laser emitting optical system 2 for condensing and emitting the laser light in a prescribed position of the substrate of a resin material, a stage 6 where the substrate is adhered closely, fixed and placed by sucking air from an air suction port which is situated the lower part of the substrate 8 made of a resin, a moving means for moving the substrate 8 of the resin material in the longitudinal direction of the resin material, an air jetting port 15 for generating the ascending stream of the air by jetting compressed air along the longitudinal direction of the outside of the substrate 8 made of the resin in the stage 6 and a dust collector for sucking the smoke and the scattered material 9 which are generated by the laser beam machining. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007054877(A) 申请公布日期 2007.03.08
申请号 JP20050245628 申请日期 2005.08.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SHIGEKAWA YASUSHI;SHIMADA JUN;IKEDA TOSHIHIRO;OMIZU YOSHIHARU
分类号 B23K26/14;B23K26/38 主分类号 B23K26/14
代理机构 代理人
主权项
地址
您可能感兴趣的专利