| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip which can be correctly determined whether it is joined in parallel to a solid device such as another semiconductor chip, and a manufacturing method thereof. <P>SOLUTION: A pad opening 26 is formed on a position opposite to an electrode pad 24 on a surface protective film 25 forming the uppermost layer of a slave chip 2, and the electrode pad 24 is exposed from the surface protective film 25 through the pad opening 26. A through hole 27 piercing the surface protective film 25 in a direction perpendicular to its surface 11 is provided on the peripheral edge portion of the surface protective film 25. A functional bump 12 is provided on the electrode pad 24, and projects at a predetermined projection quantity from the surface protective film 25, piercing the pad opening 26. A connection confirming bump 13 rises from the surface of an interlayer insulation film 23 facing the through hole 27, and projects from the surface protective film 25 at a projection quantity smaller than the projection quantity of the functional bump 12, piercing the through hole 27. <P>COPYRIGHT: (C)2007,JPO&INPIT |
