OPTICAL DEVICE ENCAPSULATION RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide an encapsulation composition for transfer molding which is excellent in transparency, UV resistance and thermal shock resistance and suitable for use in optical devices.

SOLUTION: The optical device encapsulation resin composition comprises a curing agent and silsesquioxane derivative with a ladder or random structure obtained by co-hydrolyzing and co-condensating (A) trialcoxysilane expressed by R1Si(OR)3(R's are each independently a methyl group or an ethyl group; R1is an alkyl group or a phenyl group) and (B) a trialcoxysilane expressed by R2Si(OR)3(R's are each independently a methyl group or an ethyl group; R2is a substituent containing a reactive cyclic ether group) and is B-staged.

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