发明名称 |
Lapping plate resurfacing abrasive member and method |
摘要 |
A lapping machine includes a lapping plate, and a workpiece carrier with a workpiece-holding hole disposed on the plate, a workpiece being fitted within the hole in the carrier. The workpiece is lapped while the plate and the carrier are individually rotated and loose abrasive grains are fed onto the plate. A synthetic resin-based elastic abrasive member having a Rockwell hardness (HRS) in the range of -30 to -100 is effective for resurfacing the lapping plate.
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申请公布号 |
US2007054607(A1) |
申请公布日期 |
2007.03.08 |
申请号 |
US20060516634 |
申请日期 |
2006.09.07 |
申请人 |
SHINANO ELECTRIC REFINING CO., LTD. |
发明人 |
YASUOKA KAI;KAZAMA KENICHI;TSUNEYA AYUMI;SATO SHUNJI |
分类号 |
B24B1/00;B24B29/00;B24B53/017;B24B53/12;B24D3/32;H01L21/304 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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